Sunday, December 09, 2007


Dicing Die Attach Films suit stacked die applications.

August 21, 2007 - Designed to streamline die attach process, Hysol® QMI5100 and QMI5200 are formulated to combine properties and functions of die attach film and dicing tape. Curing takes place during standard molding process, eliminating need for dispensing or curing equipment. Formulated as pressure sensitive release materials, products leave no burrs after dicing, promote bondline thickness control, and enable die placement times down to 0.1 sec.