What is Die Attach.

In the package assembly environment, die attach is a critical process step. In simple terms, die attach is placing a die (which is presented on a wafer frame) onto a metal or organic substrate using either an epoxy, solder or eutectic process to hold the die to the substrate. The most commonly used type of die attach is epoxy, possibly used by 70 to 80 percent of manufacturers today. However, as the entire scope of packaging changes to meet increasing demands for higher accuracy, greater speed, the ability to handle small die, the ability to handle a variety of substrate types and the need to address technology challenges (such as 300 mm wafers), die attach is advancing.