Technology Trends

The technology trends in the back-end industry can be summarized as "more functionality in a smaller space." Future devices will contain - in the same package - chips bonded with traditional techniques in combination with the flip chip process. Passive components may be added in the same package to increase functionality. Vertical or horizontal package integration seems to be the logical evolution. Complicated packages with seven-stacked die beside a flip chip device and a few passive components packaged in the same small unit could soon be real. Space, flexibility and cost considerations will push the limits of package design and die attach technology.

In the future, high-volume processing of very thin die (50 - 100 µm) will challenge the chip assembly industry. Packaging equipment needs to be optimized to meet the new requirements. Die pick-up, bonding process and epoxy dispensing technologies need to be fine-tuned.

In contrast to small die, there is also a trend in the industry toward very large die used in microprocessors and digital signal processors. Attaching large die requires different methods. Void-free epoxy dispensing for a large area is crucial. An increased and controlled bond force is a prerequisite for consistent chip planarity and BLT.

All of these new technology trends will only take off and survive in high-volume production if economic aspects are considered. In the area of die attach, increasing productivity without compromising placement accuracy will be key to meet adequate cost of ownership. It is essential that equipment manufacturers, material suppliers and packaging designers collaborate closely to meet future packaging requirements.